NVIDIA Jetson Orin Nano Arm-based Edge AI BOX | NPC-7112

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Features

  • NVIDIA Jetson Orin Nano 4GB/8GB module
  • Ampere architecture GPU + Cortex-A78 CPU
  • Delivers up to 40 TOPS of AI performance
  • Ideal for Deep Learning acceleration at the Edge
  • Dual GbE LAN for camera connectivity
  • WiFi, BT, 5G/4G & LoRa for remote access
  • M.2 NVMe SSD & SD card for storage
  • On-board TPM 2.0 module for security
  • Linux Ubuntu OS + NVIDIA JetPack SDK support
$688.00
delivery
in stock
DESCRIPTION
CONFIGURE & BUY
DESCRIPTION

NVIDIA Jetson Orin Nano

NVIDIA Jetson Orin Nano is a high-efficiency computing module specifically designed for edge AI and robotics applications. Based on the NVIDIA Ampere architecture, it delivers outstanding AI inference and real-time data processing capabilities in a compact design. It integrates a 6-core ARM Cortex-A78AE CPU and a GPU with 512 CUDA cores, supporting up to 40 TOPS of AI computing power (INT8), enabling efficient operation of complex neural network models. This module is compatible with the NVIDIA JetPack SDK ecosystem, providing a rich set of development tools and a pre-trained model library. It also supports multi-sensor integration and low-latency communication interfaces, making it suitable for scenarios such as intelligent drones, collaborative robots, and AIoT devices where power consumption and size are critical. It offers reliable computing power support for lightweight edge intelligence deployment.

Comprehensive I/O and Flexible Scalability

This product is designed with a diverse range of interfaces to fully meet the needs of the AI computing field, providing rich connection capabilities to adapt to complex scenarios. In addition to supporting multiple USB 3.0 and USB 2.0 interfaces for high-speed data transmission, it also integrates RS-232/485 serial ports, CAN bus and other industrial communication interfaces, as well as multi-channel digital input/output terminals, which can be seamlessly connected to sensors, industrial control equipment and external expansion modules. This flexible interface combination not only ensures the efficient operation of the AI computing core but also simplifies the collaborative deployment with edge devices, making it suitable for industrial AI scenarios such as robots and intelligent quality inspection that require multi-source data fusion.

Compact design

This product measures 187mm x 131mm x 54mm, featuring a compact design that combines high integration. It integrates an AI computing core and multiple functional interfaces within a limited space, making it suitable for complex scenarios at the edge. Besides supporting high-speed data transmission and industrial communication protocols, its miniaturized structure is adaptable to narrow deployment environments and can be flexibly embedded in hardware platforms such as robots and intelligent detection devices. While ensuring efficient computing power, it enables multi-device collaboration and industrial-grade stable connections, fully meeting the requirements of AI-driven compact intelligent systems.

Excellent cooling design

This product features an active cooling system, integrating high-performance fans and multi-layer heat sink fins to ensure the AI computing core operates stably under high loads. The cooling solution is precisely adapted to the compact body, optimizing the intelligent air duct and rapidly discharging heat to effectively balance performance and temperature control requirements. Even in confined or industrial complex environments, it can maintain low noise and high-efficiency cooling performance, providing reliable all-weather operation guarantees for edge AI applications.

Robust and Reliable

It's been tested according to IEC 60068-2-64 and IEC 60068-2-27 standards, including random vibration tests and mechanical impact tests. These tests show that the device can stand up to vibrations and shocks really well. Also, it has CE and FCC Class B certification, which means it performs great in terms of electromagnetic compatibility and safety. All this makes it perfect for industrial automation and tough environments. 

SPECIFICATIONS

System

AI Platform
NVIDIA Jetson Orin Nano 4GB/8GB
AI Performance
20 TOPS (INT8)/40 TOPS(INT8)
GPU
Ampere,512 CUDA,16 Tenso Cores,625Mhz Ampere,1024 CUDA,32 Tensor Cores,625Mhz
CPU

6-core Arm® Cortex®-A78,1.5Ghz

Neural Network
Acceleration
1x NVDLA v2 for accelerating deep learning workloads/
2x NVDLA v2 for accelerating deep learning workloads
HW Video Codec
1x 8K30 / 2x 4K60 / 4x 4K30 / 9x 1080p60 / 18x 1080p30 H.265 video decode streams
1x 4K60 / 3x 4K30 / 6x 1080p60 / 12x 1080p30 H.265 video encode streams
Memory
On-board 4GB 128-bit LPDDR5
On-board 8GB 128-bit LPDDR5
Storage & Expansion
1x M.2 2280 (PCIe x4) for NVMe SSD
1x Micro SD slot

Ethernet

Chipset
NVIDIA Jetson integrated GbE and RTL8119I
Interface
2x RJ45, 10/100/1000 Mbps

Wireless Connectivity

WiFi
1x M.2 Key E for WiFi 5/WiFi 6
5G/4G
1x M.2 Key B for 4G/5G
1x Micro SIM slot
LoRa
1x Mini PCIe for LoRa
Others
On-board LC670Z GNSS module

Multimedia

Display
1x HDMI 2.1 up to 4K 60Hz
Audio
1x 3.5mm Combo Jack

I/O

USB
1x USB 3.0 Type-C,
2x USB 3.0 Type-A,
2x USB 2.0 Type-A
Serial Port
1x 10-pin Phoenix connector (1x RS-232+1x RS-485)
1x RS-232/485 with CTS/RTS by DB9
1x RS-232/TTL internal header
CAN
1x CAN internal header (optional connect to DB9)
GPIO
1x 10-pin Phoenix connector (4-in/4-out)

Other Features

Watchdog
Watchdog Timer & power on/off management
Real Time Clock
On-board RTC chip, battery-backed
Security
On-board Z32H330TC TPM 2.0 module

Power

Power Input
12V DC-IN
Interface
2-pole lockable terminal block
System Ctrl & Monitoring
1x Power button, 1x Recovery button
1x Buzzer for alarm & diagnostics, 4x LEDs for power & wireless

Mechanical

Dimensions
187x131x54mm(7.3"x5.2"x2.1")

Software

OS Support
Ubuntu 20.04 + JetPack 5.1.2

Environment

Operating Temperature
0~60℃(32~140℉)/-20~70℃(-4~158℉) optional
Storage Temperature
-20~75℃ (-4~176℉)
Humidity
10%~95% RH (non-condensing)
Certifications
CCC, CE Class B
CONFIGURATION
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WiFi & Bluetooth
WiFi 5
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WiFi 6
Memory
4GB LPDDR5
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4GB LPDDR5
8GB LPDDR5
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8GB LPDDR5
Operating Temperature
0~60℃(32~140℉)
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0~60℃(32~140℉)
-20~70℃(-4~158℉)
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-20~70℃(-4~158℉)

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